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欧盟RoHS指令豁免项

  
很多企业对欧盟RoHS指令豁免项都不是很了解,今天企业易就为大家简单介绍一下欧盟RoHS指令豁免项,希望大家能对欧盟RoHS指令豁免项有一个深入的了解.如果对欧盟RoHS指令豁免项还有疑问,可查看更多内容.
欧盟RoHS指令豁免项

欧盟ROHS指令豁免项

由于技术问题,有部分资料或者产品的制造技术还做不到ROHS指令要求,在经过向欧盟的特殊申请后,以下项目能够获得豁免(部分豁免是有期限的):

RoHS豁免欧盟RoHS

物品豁免条款

1紧凑型荧光灯中的汞含量不超过每灯5毫克

2直管荧光灯中的汞,通常用途不超过:

卤磷酸盐10毫克

三磷酸盐,正常寿命5毫克

三磷酸盐,长寿命8毫克。

3用于特殊用途的直管荧光灯中的汞。

4本附件中未特别提及的其他灯中的汞。

5阴极射线管,电子元件和荧光灯管中的铅。

6铅作为钢中的合金元素,含铅量高达0.35%,铝含铅量高达0.4%,含铜量高达4%的铜合金。

7- 高熔点型焊料中的铅(即含铅量在85%以上的铅基合金)

lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for TELECommunications

lead in electronic CEramic parts (e.g. piezoelectronic devices).

8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations

9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.

10 Lead used in compliant pin connector systems

11 Lead as a coating material for the thermal conduction module c-ring

12 Lead and cadmium in optical and filter glass

13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight

14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages

15 DecaBDE in polymeric applications

16 Lead in lead-bronze bearing shells and bulbs

17 Lead in linear incandescent lamps with silicate coated tubes

18 Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications

19 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MGSi2O7:Pb)

20 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL)

21 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)

22 Lead and cadmium in printing inks for the application of enamels on borosilicate glass.

23 Lead as impurity in RIG (rare earth iron gamet) Faraday rotators used for fibre optic communication systems.

24 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames.

25 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

26 Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.

27 Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.

28 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.

29 Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.

30Lead bound in crystal glass as defined in Annex I (Category 1,2,3 and 4) of Council Directive 69/493/EEC

2009年6月11日,欧盟OJ刊登了2009/443/EC,新增了6项RoHS指令的豁免,分别如下:

33.Lead insolders for the soldering of thin copper wires of 100 μm diameter andless in power transformers. 电力变压器中直径100微米及以下细铜线所用焊料中的铅

34.Lead in cermet-based trimmer potentiometer elements. 金属陶瓷质的微调电位计中的铅

35.用于光电耦合器的光敏电阻器中的镉应用于专业音响设备,直至2009年12月31日。2009年12月31日前专业音频设备的光耦合器中使用的光敏电阻的镉

36.直流等离子显示器中的汞用作阴极溅射抑制剂,每个显示器的含量高达30毫克,直到2010年7月1日。2010年7月1日前直流等离子显示器中阴极溅射抑制剂中的汞,其含量不得超过30毫克/显示器

37.基于硼酸锌玻璃体的高压二极管镀层中的铅。以硼酸锌玻璃体为基础的高压二极管的电镀层的铅

38.用于铝粘结氧化铍的厚膜浆料中的镉和氧化镉。用氧化铍连接铝制成的厚膜浆料中镉和氧化镉

此前,在6月5日,欧盟还刊登了四百二十八分之二千○九/ EC,从2011年1月1日起,将原豁免的第22点“光纤通讯系统稀土铁石榴石法拉第旋转器中作为杂质的铅“从豁免列表中移除。

其实符合RoHS一直都有在增加豁免条例。

今日通过对《欧盟RoHS指令豁免项》的学习,相信你对认证有更好的认识。假如要办理相关认证,请联络我们吧。

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